CoAsia
Korean DSPs Ride Samsung Foundry Momentum, Reaching 70% of Last Year’s Sales in H1
2026.08.24
CoAsia
Foundry DSP CoAsia, Bridging the Gap from Autonomous Driving Chip Design to Production
2026.08.20
CoAsia
CoAsia SEMI Begins Mass Production of SoC with 3D IC Packaging, a First in Korea’s Design Service Industry
2026.08.11
CoAsia
CoAsia CM Recruits Former Samsung Camera Module Development Executive as New CEO
2026.07.01
CoAsia
CoAsia SEMI Expands Advanced Packaging for AI Applications as Overseas Sales Share Rises
2026.06.13
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#CoAsia SEMICoAsia SEMI Participates in LG Electronics-Led ‘K-On-Device AI’ Project to Develop Two AI SoCs
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#CoAsia SEMICoAsia SEMI Begins Mass Production of SoC with 3D IC Packaging, a First in Korea’s Design Service I..
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#CoAsia SEMICoAsia Semi Presents Next-Generation Chiplet Platform ‘CoCs™’ and Advanced Packaging Roadmap at Sam..
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#CoAsia SEMICoAsia Semi Begins Supply of SoC Products with 3D IC Packaging “Korea’s First Case, HBM next Comes 3..
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#CoAsia SEMICoAsia SEMI Announces AI Chiplet Production Collaboration With Tenstorrent
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#CoAsia SEMICoAsia SEMI and Germany’s Inova Sign ISELED Wafer Manufacturing License Agreement
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#CoAsia SEMICoAsia Semi Signs Supply Agreement with Anabatic Semi for Next-Generation BMS Semiconductor
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#CoAsia SEMICoAsia Semi Unveils Chiplet Platform ‘CoCs™’ at Arm Unlocked Seoul 2025