Press Releases

CoAsia

Korean DSPs Ride Samsung Foundry Momentum, Reaching 70% of Last Year’s Sales in H1

2026.08.24

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CoAsia

Foundry DSP CoAsia, Bridging the Gap from Autonomous Driving Chip Design to Production

2026.08.20

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CoAsia

CoAsia SEMI Begins Mass Production of SoC with 3D IC Packaging, a First in Korea’s Design Service Industry

2026.08.11

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CoAsia

CoAsia CM Recruits Former Samsung Camera Module Development Executive as New CEO

2026.07.01

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CoAsia

CoAsia SEMI Expands Advanced Packaging for AI Applications as Overseas Sales Share Rises

2026.06.13

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  • Korean DSPs Ride Samsung Foundry Momentum, Reaching 70% of Last Year’s Sales in H1
  • Foundry DSP CoAsia, Bridging the Gap from Autonomous Driving Chip Design to Production
  • CoAsia SEMI Begins Mass Production of SoC with 3D IC Packaging, a First in Korea’s Design Service Industry
  • CoAsia CM Recruits Former Samsung Camera Module Development Executive as New CEO
  • CoAsia SEMI Expands Advanced Packaging for AI Applications as Overseas Sales Share Rises
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