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CoAsia SEMI and Germany’s Inova Sign ISELED Wafer Manufacturing License Agreement

Date 2025.11.18



 

CoAsia SEMI (CEO DS Shin) announced that it has signed a wafer manufacturing license agreement with Inova Semiconductors GmbH of Germany on the 17th for ISELED, the key component used in premium automotive interior lighting.

ISELED, developed with Inova’s patented technology, is used in ambient lighting systems inside vehicles and enables uniform color expression through precise control of RGB light sources embedded within the LED module. While the technology has traditionally been adopted mainly by European OEMs, automotive manufacturers in Korea, China, and other major Asian markets are increasingly adopting ISELED-based lighting solutions to enhance interior design competitiveness.
 

Through this license agreement, Inova has secured a more stable supply chain for global OEMs and plans to expand its foundry supply capabilities and strengthen responsiveness to customers in Asia by collaborating with CoAsia SEMI, a Design Solution Partner (DSP) of Samsung Foundry.
 

With this agreement, CoAsia SEMI gains independence by being able to manufacture LED controller products based on ISELED technology in-house. In particular, the group has established a complete vertical affiliation structure—from wafer processing to packaging and LED module production—by leveraging its CoAsia ITSWELL division, which handles packaging, module manufacturing, and sales of the chip. This strengthens both supply stability and revenue streams while creating synergy across CoAsia Group affiliates.
 

CoAsia SEMI also sees strong potential for ISELED technology to expand beyond automotive interior lighting into next-generation applications such as smart lighting, micro-LED, and integrated interior displays. The company aims to enhance its competitiveness in automotive semiconductors through this technology introduction.
 

Both companies expect the agreement to contribute to shorter lead times and improved procurement efficiency for domestic automotive OEMs.

Robert Isele, CEO of Inova Semiconductors, stated, “Sharing the ISELED technology with other industry partners is key to becoming a standard in the industry,” adding, “This collaboration is another important step to further strengthen the resilient supply network for ISELED technology as required by our global customers.”
 

 

DS Shin, CEO of CoAsia SEMI and Head of the Semiconductor Division at CoAsia Group, said, “This license agreement is a clear demonstration of the synergy within the CoAsia Group, combining CoAsia SEMI’s chip design capabilities with ITSWELL’s LED packaging and assembly to build a vertically affiliated structure across the ISELED value chain.” He added, “We will continue to strengthen our competitiveness in the domestic automotive semiconductor industry and expand our automotive semiconductor portfolio.”